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EC8005 ELECTRONIC PACKAGING AND TESTING Lecture Notes Download EC8005 ELECTRONIC PACKAGING AND TESTING Lecture Notes Download
Department  Electronics Communication Engineering
Year 4th Year
Semester 7th Semester
University Anna University
Regulation  R2017
Subject Code EC8005
Subject Name ELECTRONIC PACKAGING AND TESTING
Download File EC8005 ELECTRONIC PACKAGING AND TESTING Lecture Notes, Books, Important 2 Marks Question and Answers, 16 Mark Question with Answers, Syllabus & Question Bank

 

 

EC8005 ELECTRONIC PACKAGING AND TESTING Syllabus

UNIT I OVERVIEW OF ELECTRONIC SYSTEMS PACKAGING
Functions of an Electronic Package, Packaging Hierarchy, IC packaging: MEMS packaging, consumer electronics packaging, medical electronics packaging, Trends, Challenges, Driving Forces on Packaging Technology, Materials for Microelectronic packaging, Packaging Material Properties, Ceramics, Polymers, and Metals in Packaging, Material for high density interconnect substrates

UNIT II ELECTRICAL ISSUES IN PACKAGING
Electrical Issues of Systems Packaging, Signal Distribution, Power Distribution, Electromagnetic Interference, Transmission Lines, Clock Distribution, Noise Sources, Digital and RF Issues. Design Process Electrical Design: Interconnect Capacitance, Resistance and Inductance fundamentals; Packaging roadmaps – Hybrid circuits – Resistive, Capacitive and Inductive parasitics

UNIT III CHIP PACKAGES
IC Assembly – Purpose, Requirements, Technologies, Wire bonding, Tape Automated Bonding, Flip Chip, Wafer Level Packaging, reliability, wafer level burn – in and test. Single chip packaging: functions, types, materials processes, properties, characteristics, trends. Multi chip packaging: types, design, comparison, trends. System – in – package (SIP); Passives: discrete, integrated, and embedded

UNIT IV PCB, SURFACE MOUNT TECHNOLOGY AND THERMAL CONSIDERATIONS
Printed Circuit Board: Anatomy, CAD tools for PCB design, Standard fabrication, Micro via Boards. Board Assembly: Surface Mount Technology, Through Hole Technology, Process Control and Design challenges. Thermal Management, Heat transfer fundamentals, Thermal conductivity and resistance, Conduction, convection and radiation – Cooling requirements

UNIT V TESTING
Reliability, Basic concepts, Environmental interactions. Thermal mismatch and fatigue – failures – thermo mechanically induced –electrically induced – chemically induced. Electrical Testing: System level electrical testing, Interconnection tests, Active Circuit Testing, Design for Testability

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